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Intel Alder Lake mobile chip lineup leaked (up to 16 cores with big+small designs)

Intel’s first 12th-gen Core processors for mobile devices are expected to hit the streets later this year. Based on the company’s new Alder Lake designs, the chips will be different from most previous-gen Core processors in that they’ll combine “big” and “small” CPU cores on a single chip. A leaked product slide from earlier this […]

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Intel’s unpopular Lakefield chips reach end of life a year after launch

Later this year Intel plans to launch its first Alder Lake mobile processors designed to combine two different CPU architectures on a single chip. The idea is to deliver up to a 14-core processor that features a mix of high-performance and energy-efficient CPU cores. But Alder Lake-P chips won’t be the first processors from Intel […]

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Intel Alder Lake-P details leaked: Mobile processor with 14 cores, 20 threads

Intel’s first foray into hybrid processors that combine different types of CPU cores in a single chip wasn’t all that exciting due to lackluster performance and a focus on efficiency for thin, light, and fanless computers. But it looks like the next Hybrid chip could pack a lot more horsepower. Leaked benchmark results for an upcoming […]

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Intel launches Lakefield hybrid chips for thin and light computers

Intel’s new Lakefield processors are the company’s first hybrid processors that combine higher-performance Intel Core CPU cores with energy-efficient Atom cores. They’re basically Intel’s answer to ARM’s big.LITTLE designs. But Intel goes about things in a somewhat different way by using its new Foveros 3D packaging technology to create a single chip featuring multiple CPU architectures. […]

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Rumor: Intel “Alder Lake-S” could be a 16-core desktop processor (with big.LITTLE-like design)

Intel’s Foveros technology allows the chip maker to deliver processors featuring CPU cores spanning multiple architectures. This allows, for example, a set of low-power, energy-efficient CPU cores to be combined with a set of power-hungry, higher-performance cores. So far Intel has only unveiled one product that uses this design — the upcoming Intel Lakefield processor […]

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Intel: At least 3 PCs with Lakefield chips coming this year

Intel’s new “Lakefield” processors is the first chip manufactured using the company’s Foveros 3D technology. The company says that means that rather than laying out the components on a flat, pancake-like surface, Lakefield chips are more like a cake with multiple layers… if that cake measured just 12mm x 12mm x 1mm. The design allows […]

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Intel unveils “Sunny Cove” CPU architecture for next-gen chips

Intel is outlining a few big changes coming to its chips next year. First up is the new “Sunny Cove” architecture that’ll be used to produce next-gen Xeon (server) and Core (laptop and desktop) processors in late 2019. The chip maker says we can expect higher caches, reduced latency, higher throughput, and support for performing […]